Imago Scientific Instruments Corp. will showcase its revolutionary LEAP® Microscope at the ISTFA conference (booth 516) to be held November 6 – 10, 2005 at the San Jose McEnery Convention Center. The LEAP® analyzes materials by removing and examining individual atoms, enabling metrology at the atomic scale. The true power of the LEAP® lies in its ability to tie compositional information to structure on the atomic scale, thereby allowing manufacturers to identify, analyze, and eliminate nanometer scale defects which result in yield loss.
The decreasing feature sizes used in the microelectronics industry are challenging failure analysis engineers to analyze materials on an atomic scale. For example, manufacturers of read heads want to understand why some of their read heads, which are composed of multiple layers as thin as five angstroms (one to two atom spacings), are working well while others are not. Visitors to the Imago Scientific Instruments Corp. exhibit will be provided information on how the LEAP® Microscope can be used to perform failure analysis on the atomic scale.
What is available at Imago’s booth?
Guests to Imago’s booth will see first hand the power of the Atom Probe. Demonstrations will highlight exactly how the LEAP® 3000X identifies and displays elements and isotopes within a sample and provides a 3 dimensional image of their location within the sample structure. The experts from Imago’s scientific staff will be on hand to provide details about the technology, reconstruction techniques and capabilities available with the LEAP® and how LEAP® technology can compliment your existing failure analysis techniques.
For more information, press only:
Jason Schneir, (608) 274-6880, jschneir@imago.com
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